Description
⚙️ Core Specifications Cooling Capacity (TDP): Up to 150W (ideal for Core i3/i5 or Ryzen 3/5 non-X models) Heat Pipes: 3× Ø6 mm direct-touch copper heat pipes (left unpainted/exposed copper at the baseplate) Heatsink Design: Classic raw aluminum matrix fin array with exposed heat pipe tips on top (no decorative top plastic shroud or plate) Dimensions: 119 × 77 × 129 mm (L×W×H) — Standing at just 129mm tall, it easily fits into smaller micro-ATX or budget mid-tower cases where standard 155mm+ towers clash with the side panel. Net Weight: Extremely light at 350 g 💨 Fan Specs (92mm PWM) Instead of the standard 120mm fan used on the AK series, the AG300 uses a smaller, high-RPM 92mm fan to keep its profile compact: Dimensions: 92 × 92 × 25 mm Speed Range: 500 ~ 3050 RPM ±10% (PWM controlled to ramp up aggressively under load) Airflow: 36.75 CFM Static Pressure: 2.89 mmAq Noise Level: ≤30.5 dB(A) at maximum speed 🛠️ Socket Compatibility Intel: LGA1851 / LGA1700 / LGA1200 / LGA1151 / LGA1150 / LGA1155 AMD: AM5 / AM4
